🇨🇳 IEEE IVMSP 2026: Call for Papers – Multimodality AI
Location: China
Deadline: January 28, 2026
IEEE IVMSP 2026 invites paper submissions on ‘Image and Video for Multimodality AI’. Event: June 16–19, 2026, in Shenzhen, China. Deadline: January 28, 2026.
The 2026 IEEE 15th Image, Video, and Multidimensional Signal Processing Workshop (IVMSP 2026) invites submissions on ‘Image and Video for Multimodality AI’. The event will be held on June 16–19, 2026, in Shenzhen, China.
Key highlights include:
- Sponsored by the IEEE Signal Processing Society
- Technical program with plenary talks, tutorials, and poster sessions
- Keynote Speakers: Zhengyou Zhang, Zhou Wang, and Wen Gao
Topics of interest include multimodal learning, embodied AI, unmanned aerial vehicles, and more. Special tracks focus on ‘AI for Healthcare’ and ‘Explainable Machine Learning’.
Visit http://2026.ieeeivmsp.org/ for more information.
Paper submission deadline: January 28, 2026.
Tags: IEEE IVMSP 2026, Multimodality AI, Image Processing, Signal Processing, Machine Learning, Computer Vision, AI for Healthcare